Besi stock: Applied Materials expands AI packaging partnership

Applied Materials expanded its strategic relationship with BE Semiconductor Industries, known as Besi, on Thursday, November 12, 2026. The announcement links Besi more closely to the development of advanced packaging technologies used in next-generation artificial intelligence chips.

In its Applied Materials release, the US semiconductor-equipment maker said Besi will join its EPIC Center as an innovation partner. The cooperation extends beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry's artificial-intelligence roadmap.

Ownership plan remains pending

Applied Materials also entered an accelerated share purchase agreement that would increase its investment in Besi to approximately 20 percent of the outstanding shares. The transaction remains subject to the expiration or termination of the applicable United States Hart-Scott-Rodino antitrust waiting period. Applied Materials said it does not intend to seek a board seat or raise the planned holding beyond that level.

The expanded work covers three-dimensional integrated-circuit scaling, logic and memory integration, thermo-compression bonding and die-on-wafer, die-on-die and die-on-panel platforms. For Besi, the partnership strengthens the strategic position of its packaging technology, while commercial benefits still depend on customer adoption, production readiness and equipment deliveries.

AI demand remains the market focus

On Friday, November 13, TechShots reported that Besi had distinguished its hybrid-bonding activities from ASML's focus on three-dimensional transistor stacking. The report also cited strong AI-related order momentum and a 100 million euro share buyback.

Besi stock traded at 155.85 euros on Lang & Schwarz at 11:57 CET on Saturday, November 14, 2026.

The broader Dutch equity market can be followed through current market reports.

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