Unisem stock: RM396 million Gopeng expansion targets AI demand

Unisem (M) Bhd plans a second phase of its Gopeng expansion in Perak, Malaysia, with a total investment of RM396 million, The Edge Malaysia reported on October 9, 2026. The project is designed to raise capacity for wafer bumping and post-bump services used in advanced semiconductor packaging.

Gopeng investment targets AI demand

The planned facility will have about 40,000 square meters of built-up area. Construction, infrastructure and utilities are estimated at RM196 million, while equipment and facility preparation are expected to require a further RM200 million.

Half of the new facility will be leased to Unisem Advanced Technologies, a wholly owned subsidiary that will expand wafer-bumping operations. Unisem said the investment is intended to capture demand from artificial intelligence, data centers and high-performance computing.

The project is expected to be funded through internally generated funds and bank borrowings, although the proportions have not been determined. The company said the expansion should contribute positively after completion and operation, while it is not expected to materially affect earnings in the current financial year.

Capacity remains the central investor focus

Unisem provides outsourced semiconductor assembly and test services, including packaging-related production and testing. The Gopeng plan extends an earlier investment in the site and places the company in a specialist position within Malaysia's semiconductor manufacturing base, alongside larger international OSAT providers such as ASE Technology, Amkor Technology and JCET.

Malaysia's equity market provides the broader setting for regional semiconductor and technology shares; current market reports cover the wider trading environment.

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