New Korean chip-implanter tool, HPSP 150, targets advanced foundry demand

Edited by ad hoc news New Releases & Launches Desk. Reviewed before publication on 06/15/2026 at 9:32 PM ET. Details in the imprint.

With semiconductor capital spending still tilted toward cutting-edge logic and memory, South Korea-based HPSP is pushing its HPSP 150 high-pressure plasma doping system as a workhorse tool for 300 mm wafer production in advanced fabs. The system, which handles batch processing under high pressure, is designed for ultra-shallow junction formation at nodes used by leading foundries and memory makers.

What the HPSP 150 does in the fab

The HPSP 150 is a high-pressure plasma doping (HPPD) system that uses a batch chamber to dope 300 mm silicon wafers, targeting applications such as source-drain extension and contact doping in advanced CMOS and memory devices. According to the company’s English catalog, the tool supports high-dose, low-energy processes in a controlled high-pressure environment to achieve ultra-shallow junctions with reduced crystal damage compared with conventional beam-line ion implanters, an approach HPSP pitches as enabling better device performance and reliability for leading-edge nodes. The official HPSP product page describes the 150 as a batch-type HPPD system for 300 mm wafers.

Instead of accelerating ions in a beam, HPPD generates a plasma containing dopant species in a high-pressure chamber, allowing ions to diffuse into the wafer surface with much lower physical damage to the crystal structure. HPSP states that this approach can form ultra-shallow junctions with steep profiles while keeping leakage currents under control, a combination that is particularly important for high-density DRAM and 3D NAND as well as low-power mobile and high-performance logic chips that continue to scale feature sizes. Industry reports on Korean equipment makers also note that high-pressure plasma doping is seeing adoption at global foundries and memory producers because it can complement or replace some beam-line implantation steps in advanced process flows. Coverage in ETNews has highlighted HPSP as a specialist in high-pressure plasma doping tools for leading chipmakers.

The HPSP 150’s batch architecture is designed to process multiple 300 mm wafers simultaneously, which HPSP positions as a way to improve throughput and lower cost of ownership compared with single-wafer systems for compatible process steps. In its marketing material, the company emphasizes that the system offers a combination of uniformity, repeatability and integration-friendly footprint aimed at high-volume manufacturing environments. While HPSP does not publicly disclose a list of customers for this specific model, Korean business media have reported that HPPD tools from the company have been qualified by major global foundries and memory manufacturers, suggesting that the 150 sits within a family of tools that already has a presence at top-tier fabs outside South Korea.

From a process-integration standpoint, the HPSP 150 is geared toward front-end-of-line and some middle-of-line steps where precise shallow doping is critical. The high-pressure plasma environment helps manage issues such as channeling and crystal damage, which can be problematic in beam implantation at very low energies, and it is particularly suited to forming junctions in aggressively scaled transistors and advanced contact structures. For chipmakers, the potential appeal is a combination of performance metrics, like tighter sheet-resistance distribution and lower leakage, alongside manufacturing metrics such as cycle time and cost per wafer, though specific numerical performance and pricing data are not disclosed by HPSP in public materials.

HPSP positions the HPSP 150 as part of a broader portfolio of high-pressure plasma doping equipment that includes tools optimized for different wafer sizes and process steps, allowing customers to build out HPPD capacity across multiple device platforms. The company’s investor materials describe high-pressure plasma doping as its core technology focus and cite demand for advanced node production at global foundries and memory makers as a key driver of tool orders in recent years, putting systems such as the 150 at the center of its long-term growth story. A recent HPSP investor presentation underscores that HPPD tools for 300 mm fabs account for a significant share of its sales.

For HPSP, which is headquartered in Hwaseong, Gyeonggi-do, the HPSP 150 and its related systems are strategically important as it competes with larger global equipment makers in a specialized niche of the implant and doping market. The company is publicly listed in South Korea; its shares (ISIN KR7403870009) closed on the Korea Exchange at KRW 83,500 on 06/14/2026, reflecting investor expectations that demand for high-pressure plasma doping tools such as the HPSP 150 will track continued investment in advanced semiconductor nodes.

This article was a.i.-assisted and editorially reviewed. Product information without warranty; prices and availability may change at short notice. Not investment advice and not a buy or sell recommendation. Trading involves risk up to and including the total loss of invested capital.